Ko, Ta: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

1

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Yong, Qing Xiang, Fan, Nelson, Kuah, Eric,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 5.12 MB

english, 2018

2

[IEEE 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] 2015 International Symposium on VLSI Technology, Systems and Applications - Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor

Chang, Hsiang-Hung, Hsiao, Zhi-Cheng, Wang, Jen-Chun, Chien, Chun-Hsien, Ko, Cheng-Ta, Zhan, Chau-Jie, Huang, Yu-Wei, Hsin, Yu-Chen, Wang, Chung-Chih, Tzeng, Pei-Jer, Lin, Cha-Hsin, Lee, Chia-Hsin, Ch

Year:

2015

Language:

english

File:

PDF, 941 KB

english, 2015

3

Awareness of HIV/AIDS prevention and acceptance of HIV testing among residents in Likoma Island, northern Malawi

Hung Che Chiang, Kwong Leung Yu, Shue Fang Yap, Kah Kheng Goh, Meng Hsuan Mo, Ta Wei Yang, Yeh Giin Ngo, Shu Jung Hsu, Yi Ching Wu, Chung Sheng Lai, Ying Chin Ko, Po Ya Chang

Journal:

Transactions of the Royal Society of Tropical Medicine and Hygiene

Year:

2009

Language:

english

File:

PDF, 156 KB

english, 2009

4

High-Efficiency Broadband Anomalous Reflection by Gradient Meta-Surfaces

Sun, Shulin, Yang, Kuang-Yu, Wang, Chih-Ming, Juan, Ta-Ko, Chen, Wei Ting, Liao, Chun Yen, He, Qiong, Xiao, Shiyi, Kung, Wen-Ting, Guo, Guang-Yu, Zhou, Lei, Tsai, Din Ping

Journal:

Year:

2012

Language:

english

File:

PDF, 444 KB

english, 2012

5

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications

Lin, Yu-Min, Wu, Sheng-Tsai, Wang, Chun-Min, Lee, Chia-Hsin, Huang, Shin-Yi, Lin, Ang-Ying, Chang, Tao-Chih, Lin, Puru Bruce, Ko, Cheng-Ta, Chen, Yu-Hua, Su, Jay, Liu, Xiao, Prenger, Luke, Chen, Kuan-

Year:

2019

Language:

english

File:

PDF, 840 KB

english, 2019

6

Optimization of the design parameters of Parallel-Plain Fin heat sink module cooling phenomenon based on the Taguchi method

Journal:

International Communications in Heat and Mass Transfer

Year:

2005

Language:

english

File:

PDF, 140 KB

english, 2005

7

Health risk of aerosols and toxic metals from incense and joss paper burning

Hsin Ta Hsueh, Tzu Hsing Ko, Wen Chieh Chou, Wen Chi Hung, Hsin Chu

Journal:

Environmental Chemistry Letters

Year:

2012

Language:

english

File:

PDF, 372 KB

english, 2012

8

Modeling and analyzing the effects of air-cooled turning on the machinability of Ti–6Al–4V titanium alloy using the cold air gun coolant system

Nun-Ming Liu, Ko-Ta Chiang, Chen-Ming Hung

Journal:

The International Journal of Advanced Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.27 MB

english, 2013

9

Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O Application

Chang, Yao-Jen, Ko, Cheng-Ta, Yu, Tsung-Han, Hsieh, Yu-Sheng, Chen, Kuan-Neng

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 1.14 MB

english, 2015

10

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology

Hsiao, Zhi-Cheng, Ko, Cheng-Ta, Chang, Hsiang-Hung, Fu, Huan-Chun, Chiang, Chia-Wei, Hsu, Chao-Kai, Shen, Wen-Wei, Lo, Wei-Chung

Year:

2015

Language:

english

File:

PDF, 1.00 MB

english, 2015

11

Targeted Sequencing of Circulating Cell Free DNA Can Be Used to Monitor Therapeutic Efficacy of Tyrosine Kinase Inhibitors in Non-small Cell Lung Cancer Patients

CHIOU, CHIUAN-CHIAN, WANG, CHIH-LIANG, LUO, JI-DUNG, LIU, CHIEN-YING, KO, HOW-WEN, YANG, CHENG-TA

Journal:

Cancer genomics & proteomics

Year:

2020

File:

PDF, 27.07 MB

2020

12

Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications

Shih, Jian-Yu, Huang, Wen-Chun, Ko, Cheng-Ta, Yang, Zheng, Hu, Sheng-Hsiang, Leu, Jihperng, Chou, Keng C., Chen, Kuan-Neng

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.11 MB

english, 2014

13

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Feasibility Study of Fan-Out Wafer-Level Packaging for Heterogeneous Integrations

Lau, John, Li, Ming, Xu, Iris, Chen, Tony, Tan, Kim Hwee, Li, Zhang, Fan, Nelson, Kuah, Eric, So, Raymond, Lo, Penny, Cheung, Y. M., Xi, Cao, Beica, Rozalia, Lim, Sze Pei, Lee, NC, Ko, Cheng-Ta, Yang,

Year:

2019

Language:

english

File:

PDF, 1.15 MB

english, 2019

14

A resilience optimization model for transportation networks under disasters

Liao, Tsai-Yun, Hu, Ta-Yin, Ko, Yi-No

Journal:

Natural Hazards

Year:

2018

Language:

english

File:

PDF, 835 KB

english, 2018

15

Integrating the Kano model with NSD and EMF to assess the innovative attributes of service quality – an empirical study of Taiwan's KTV service industry

Lo, Ta-Sheng, Wei, Hsiao-Lan, Lu, Hsi-Peng, Ko, Hsien-Tang

Journal:

Quality Technology & Quantitative Management

Year:

2016

Language:

english

File:

PDF, 1.66 MB

english, 2016

16

Emissions and efficiency of a domestic gas stove burning natural gases with various compositions

Yung-Chang Ko, Ta-Hui Lin

Journal:

Energy Conversion and Management

Year:

2003

Language:

english

File:

PDF, 1.22 MB

english, 2003

17

Recycling of desulfurization slag for the production of autoclaved aerated concrete

Chen, Ying-Liang, Ko, Ming-Sheng, Chang, Juu-En, Lin, Chun-Ta

Journal:

Construction and Building Materials

Year:

2018

Language:

english

File:

PDF, 1.34 MB

english, 2018

18

Modeling and analysis of the effects of machining parameters on the performance characteristics in the EDM process of Al2O3+TiC mixed ceramic

Journal:

The International Journal of Advanced Manufacturing Technology

Year:

2008

Language:

english

File:

PDF, 272 KB

english, 2008

19

Effect of pore size on ECM secretion and cell growth in gelatin scaffold for articular cartilage tissue engineering

Sio-Mei Lien, Liang-Yu Ko, Ta-Jen Huang

Journal:

Acta Biomaterialia

Year:

2009

Language:

english

File:

PDF, 1.12 MB

english, 2009

20

DEALING WITH COMPLICATED STARTING VALUE IN SHOOTING PROCESS WITH BROYDEN'S METHOD: EXAMPLE OF THE ONSET OF CONVECTION FOR THE VISCOELASTIC FLUID

Journal:

International Communications in Heat and Mass Transfer

Year:

2004

File:

PDF, 729 KB

2004

21

Measurement of Nasalance Scores Without Touching the Philtrum for Better Comfort During Speech Assessment and Therapy: A Preliminary Study

Yang, Xiaopeng, Pratama, Gradiyan Budi, Choi, Younggeun, You, Heecheon, TÃ¢m, Nguyá»n Phu'Ã²'c Minh, Kim, Gi-Wook, Jo, Yun-Ju, Ko, Myoung-Hwan

Journal:

The Cleft Palate-Craniofacial Journal

Year:

2020

File:

PDF, 609 KB

2020

22

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Process, assembly and electromigration characteristics of glass interposer for 3D integration

Chien, Chun-Hsien, Lee, Ching-Kuan, Lin, Chun-Te, Lin, Yu-Min, Zhan, Chau-Jie, Chang, Hsiang-Hung, Hsu, Chao-Kai, Fu, Huan-Chun, Shen, Wen-Wei, Huang, Yu-Wei, Ko, Cheng-Ta, Lo, Wei-Chung, Lu, Yung Jea

Year:

2014

Language:

english

File:

PDF, 2.51 MB

english, 2014

23

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

Shen, Wen-Wei, Chang, Hsiang-Hung, Wang, Jen-Chun, Ko, Cheng-Ta, Tsai, Leon, Wang, Bor Kai, Shorey, Aric, Lee, Alvin, Su, Jay, Bai, Dongshun, Huang, Baron, Lo, Wei-Chung, Chen, Kuan-Neng

Year:

2015

Language:

english

File:

PDF, 982 KB

english, 2015

24

Wafer-level bonding/stacking technology for 3D integration

Cheng-Ta Ko, Kuan-Neng Chen

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

25

Corrosion Resistance of Different Nickel-Titanium Archwires in Acidic Fluoride-containing Artificial Saliva

Lee, Tzu-Hsin, Huang, Ta-Ko, Lin, Shu-Yuan, Chen, Li-Kai, Chou, Ming-Yung, Huang, Her-Hsiung

Journal:

The Angle Orthodontist

Year:

2010

Language:

english

File:

PDF, 2.46 MB

english, 2010

26

Surgical Management of Severe Peri-implantitis in the Esthetic Zone: A Case Report with a 6-Year Follow-Up

Fu, Po-Sung, Wu, Yi-Min, Wang, Jen-Chyan, Huang, Ta-Ko, Chen, Wen-Cheng, Tseng, Yu-Chuan, Hung, Chun-Cheng

Journal:

Journal of Oral Implantology

Year:

2014

Language:

english

File:

PDF, 813 KB

english, 2014

27

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Ko, Cheng-Ta, Yang, Henry, Lau, John, Li, Ming, Li, Margie, Lin, Curry, Lin, JW, Chen, Tony, Xu, Iris, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Yong, Qing Xiang, Fan, Nelson, Kuah, Eric, Li, Z

Year:

2018

Language:

english

File:

PDF, 1.09 MB

english, 2018

28

Risks of bipolar disorder, depressive disorder, and traumatic brain injury among siblings of patients with attention-deficit hyperactivity disorder

Wei, Han-Ting, Pan, Tai-Long, Hsu, Ju-Wei, Huang, Kai-Lin, Bai, Ya-Mei, Ko, Nai-Ying, Su, Tung-Ping, Li, Cheng-Ta, Tsai, Shih-Jen, Lin, Wei-Chen, Chen, Tzeng-Ji, Chen, Mu-Hong

Journal:

Journal of Affective Disorders

Year:

2018

Language:

english

File:

PDF, 719 KB

english, 2018

29

Robust and blind image watermarking in DCT domain using inter-block coefficient correlation

Ko, Hung-Jui, Huang, Cheng-Ta, Horng, Gwoboa, WANG, Shiuh-Jeng

Journal:

Information Sciences

Year:

2019

Language:

english

File:

PDF, 2.49 MB

english, 2019

30

On Chatter Vibrations of Machine Tool or Work Due to Regenerative Effect and Time Lag

Ōta, H., Kōno, K.

Journal:

Journal of Engineering for Industry

Year:

1974

Language:

english

File:

PDF, 808 KB

english, 1974

31

Comparison of 18F-FDG PET/MRI, MRI, and 18F-FDG PET/CT for the detection of synchronous cancers and distant metastases in patients with oropharyngeal and hypopharyngeal squamous cell carcinoma

Yeh, Chih-Hua, Chan, Sheng-Chieh, Lin, Chien-Yu, Yen, Tzu-Chen, Chang, Joseph Tung-Chieh, Ko, Sheung-Fat, Fan, Kang-Hsing, Wang, Hung-Ming, Liao, Chun-Ta, Ng, Shu-Hang

Journal:

European Journal of Nuclear Medicine and Molecular Imaging

Year:

2019

Language:

english

File:

PDF, 9.37 MB

english, 2019

32

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fan-In Panel-Level with Multiple Diced Wafers Packaging

Lau, John H, Ko, Cheng-Ta, Tseng, Tzvy-Jang, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Lin, Eagle, Chang, Leo, Liu, Hsing Ning, Cheng, David

Year:

2020

File:

PDF, 1.65 MB

2020

33

Application of response surface methodology in describing the thermal performances of a pin-fin heat sink

Ko-Ta Chiang, Chih-Chung Chou, Nun-Ming Liu

Journal:

International Journal of Thermal Sciences

Year:

2009

Language:

english

File:

PDF, 679 KB

english, 2009

34

The Effects of Mechanical Uniaxial Stress on Junction Leakage in Nanoscale CMOSFETs

Tzu-Juei Wang, Chih-Hsin Ko, Shoou-Jinn Chang, San-Lein Wu, Ta-Ming Kuan, Wen-Chin Lee

Journal:

IEEE Transactions on Electron Devices

Year:

2008

Language:

english

File:

PDF, 319 KB

english, 2008

35

Management of unilaterally deep impacted first, second, and third mandibular molars

Fu, Po-Sung, Wang, Jen-Chyan, Chen, Cheng-Hwei, Huang, Ta-Ko, Tseng, Chin-Huang, Hung, Chun-Cheng

Journal:

The Angle Orthodontist

Year:

2012

Language:

english

File:

PDF, 1.15 MB

english, 2012

36

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package

Lin, Puru Burce, Ko, Cheng-Ta, Ho, Wei-Tse, Kuo, Chi-Hai, Chen, Kuan-Wen, Chen, Yu-Hua, Tseng, Tzyy-Jang

Year:

2017

Language:

english

File:

PDF, 706 KB

english, 2017

37

Analytic transient solutions of a cylindrical heat equation with a heat source

Ko-Ta Chiang, Kuang Yuan Kung, H.M. Srivastava

Journal:

Applied Mathematics and Computation

Year:

2009

Language:

english

File:

PDF, 192 KB

english, 2009

38

Designing parameter optimization of a Parallel-Plain Fin heat sink using the grey-based fuzzy algorithm with the orthogonal arrays

Chih-Chung Chou, Nun-Ming Liu, Jenn-Tsong Horng, Ko-Ta Chiang

Journal:

International Journal of Thermal Sciences

Year:

2009

Language:

english

File:

PDF, 496 KB

english, 2009

39

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Process and characterization of ultra-thin film packages

Kuo, Tzu-Ying, Hsiao, Zhi-Cheng, Hung, Yin-Po, Li, Wei, Chen, Kuo-Chyuan, Hsu, Chao-Kai, Ko, Cheng-Ta, Chen, Yu-Hua

Year:

2010

Language:

english

File:

PDF, 234 KB

english, 2010

40

Oscillatory instability analysis of Bénard-Marangoni convection in a rotating fluid under a uniform magnetic field

Fu-Ping Chang, Ko-Ta Chiang

Journal:

International Journal of Heat and Mass Transfer

Year:

1998

Language:

english

File:

PDF, 823 KB

english, 1998

41

[IEEE 2008 2nd Electronics Systemintegration Technology Conference - Greenwich (2008.09.1-2008.09.4)] 2008 2nd Electronics Systemintegration Technology Conference - Stacking of ultra-thin film packages

Cheng-Ta Ko,, Ying-Ching Shih,, Jing-Yao Chang,, Tzu-Ying Kuo,, Yu-Hua Chen,, Ostmann, A., Manessis, D.

Year:

2008

Language:

english

File:

PDF, 15.89 MB

english, 2008

42

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Process integration of 3D stacking for backside illuminated image sensor

Hsiao, Zhi-Cheng, Ko, Cheng-Ta, Chang, Hsiang-Hung, Fu, Huan-Chun, Chao-Kai Hsu,, Shu-Man Li,, Tsai, Wen-Li, Wen-Wei Shen,, Jen-Chun Wang,, Yu-Min Lin,, Wei-Chung Lo,

Year:

2014

Language:

english

File:

PDF, 1.48 MB

english, 2014

43

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electrical investigation and reliability of 3D integration platform using Cu TSVs and micro-bumps with Cu/Sn-BCB hybrid bonding

Chang, Yao-Jen, Ko, Cheng-Ta, Hsiao, Zhi-Cheng, Chiang, Cheng-Hao, Fu, Huan-Chun, Yu, Tsung-Han, Fan, Cheng-Han, Lo, Wei-Chung, Chen, Kuan-Neng

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

44

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Next Standard Packaging Method for DRAM - Chip-in-Substrate Package

Ko, Cheng-ta, Chang, Tao-chih, Chiang, Chia-wen, Kuo, Tzu-ying, Shih, Ying-ching, Chen, Yu-hua

Year:

2006

Language:

english

File:

PDF, 5.79 MB

english, 2006

45

Preparation of polystyrene/clay nanocomposite by suspension and emulsion polymerization

Wei-Ta Yang, Tzu-Heng Ko, Shu-Chun Wang, Ping-I Shih, Ming-Jen Chang, George J. Jiang

Journal:

Polymer Composites

Year:

2008

Language:

english

File:

PDF, 302 KB

english, 2008

46

A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication

Chang, Shu-Ming, Cheng, Chih-Yuan, Shen, Li-Cheng, Chiang, Kuo-Ning, Hwang, Yu-Jiau, Chen, Yu-Fang, Ko, Cheng-Ta, Chen, Kuo-Chyuan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.10 MB

english, 2007

47

A prospective randomized study of stent graft placement after balloon angioplasty versus balloon angioplasty alone for the treatment of hemodialysis patients with prosthetic graft outflow stenosis

Yang, Hsuan-Tzu, Yu, Sheng-Yueh, Su, Ta-Wei, Kao, Tsung-Chi, Hsieh, Hung-Chang, Ko, Po-Jen

Journal:

Journal of Vascular Surgery

Year:

2018

Language:

english

File:

PDF, 647 KB

english, 2018

48

The optimal process conditions of an injection-molded thermoplastic part with a thin shell feature using grey-fuzzy logic: A case study on machining the PC/ABS cell phone shell

Journal:

Materials & Design

Year:

2007

Language:

english

File:

PDF, 462 KB

english, 2007

49

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Lau, John, Li, Ming, Tian, Dewen, Fan, Nelson, Kuah, Eric, Kai, Wu, Li, Margie, Hao, J., Cheung, Ken, Li, Zhang, Tan, Kim Hwee, Beica, Rozalia, Ko, Cheng-Ta, Chen, Yu-Hua, Lim, Sze Pei, Lee, Ning Chen

Year:

2017

Language:

english

File:

PDF, 1.53 MB

english, 2017

50

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package

Yang, Kai-Ming, Chou, Tzu-Chieh, Ko, Cheng-Ta, Lin, Chen-Hao, Chen, Yu-Hua, Tseng, Tzyy-Jang, Wu, Wen-Wei, Chen, Kuan-Neng

Year:

2019

Language:

english

File:

PDF, 526 KB

english, 2019

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@1delivery.pm

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски